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ITEM
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CHIP CERAMIC INDUCTORS
Features
1. SMD type chip inductors utilizing monolithic structure provide highly reliable surface mount applications. 2. Superior Q characteristics is guaranteed over the wide frequency range to allow high frequency applications. 3. Terminal electrode has excellent solder heat resistance for soldering.
Applications
1. RF module of telecommunication products. - Cellular phone, Cordless telephone, Pagers etc. 2. GSM Phone, PCS Phone. 3. Computer communications, Radar detectors. 4. Automotive electronics, Keyless remote.
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Ordering Information
CI - B
(1) (2)
1608 - 120 - K
(3) (4) (5)
J
(6)
T
(7)
(5) Tolerance S : 3/4 0.3nH J : 3/4 5% K : 3/4 10% (6) Termination J : Nickel barrier (c)i Packing B : Bulk Packing T : Tape & Reel (O L : Tape & Reel (O
(1) Series (2) Material & design (3) Dimensions The first two digits : length((R) ) The last two digits : width((R) ) (4) Inductance The first two digits are signigicant. The last digit is the number of zeros following. N : a decimal point placed between first two digits
178(R) 254(R)
[ 7inches]) [10inches])
Shape and Dimensions
Type CI-a 1005T W C(c)u
CI-a 1608CI-a 2012L
L 1.03/4 0.10 .0393/4 .004 1.63/4 0.15 .0633/4 .006 2.03/4 0.2 .0793/4 .008
W 0.53/4 0.10 .0203/4 .004 0.83/4 0.15 .0313/4 .006 1.253/4 0.2 .0493/4 .008
unit : mm [inches] T C 0.53/4 0.10 0.203/4 0.10 .0203/4 .004 .0083/4 .004 0.83/4 0.15 0.303/4 0.20 .0313/4 .006 .0123/4 .008 0.503/4 0.30 1.03/4 0.2 .0203/4 .012 .0473/4 .008
O
The polarity mark can be provided upon customer's request.
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CHIP CERAMIC INDUCTORS
Specifications
CI1005 |
Part No. CI-B1005-10Na CI-B1005-12Na CI-B1005-15Na CI-B1005-18Na CI-B1005-22Na CI-B1005-27Na CI-B1005-33Na CI-B1005-39Na CI-B1005-47Na CI-B1005-56Na CI-B1005-68Na CI-B1005-82Na CI-B1005-100 a CI-B1005-120a CI-B1005-150a CI-B1005-180a CI-B1005-220a CI-B1005-270a CI-B1005-330a CI-B1005-390a CI-B1005-470a CI-B1005-560a CI-B1005-680a CI-B1005-820a CI-B1005-101a Inductance nH 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12 15 18 22 27 33 39 47 56 68 82 100 Tolerance Q 100O min. 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Q 800O min. 20 20 20 22 22 22 22 22 22 22 22 20 20 20 20 20 20 17 16 16 10 Q 1.8x min. 26 26 30 35 35 35 35 30 30 28 28 28 24 24 20 15 13 SRF (O min. 6000 6000 6000 6000 6000 6000 6000 4000 4000 4000 3900 3600 3200 2700 2300 2100 1900 1600 1300 1200 1000 750 700 600 350 ) typ. 13000 10000 10000 9500 9000 9000 8000 6500 5000 5000 4400 4000 3500 3500 3000 2600 2200 1900 1700 1600 1300 900 800 700 650 DCR (mO ) max. 100 120 120 140 160 200 220 250 280 300 350 400 450 500 550 650 800 900 1100 1200 1300 1400 1400 1600 2000
Rated current (mA) max 300 300 300 300 300 300 300 300 300 300 300 250 250 200 200 200 200 200 200 100 100 100 100 100 100
3/4 0.3nH
3/4
5%
* SRF : Self-Resonant Frequency.
* DCR : DC Resistance
Electrical characteristics
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CHIP CERAMIC INDUCTORS
CI1608 |
Part No. CI-B1608-10Na CI-B1608-12Na CI-B1608-15Na CI-B1608-18Na CI-B1608-22Na CI-B1608-27Na CI-B1608-33Na CI-B1608-39Na CI-B1608-47Na CI-B1608-56Na CI-B1608-68Na CI-B1608-82Na CI-B1608-100a CI-B1608-120a CI-B1608-150a CI-B1608-180a CI-B1608-220a CI-B1608-270a CI-B1608-330a CI-B1608-390a CI-B1608-470a CI-B1608-560a CI-B1608-680a CI-B1608-820a CI-B1608-101a CI-B1608-121a CI-B1608-151a CI-B1608-181a CI-B1608-221a CI-B1608-271a * SRF : Self-Resonant Frequency. Inductance nH 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 Tolerance Q min. 8 8 8 8 8 8 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 8 8 8 8 8 L, Q test frequency (O 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 ) SRF (O ) DCR (mO ) max. 100 100 100 120 160 200 220 250 280 290 300 330 350 400 450 500 550 600 650 700 900 1000 1200 1500 1700 2000 2400 2700 2800 3100
Rated current (mA) max 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 250 200 200 200 200
3/4 0.3nH
3/4
5%
3/4 10%
min. typ. 4000 13000 4000 13000 4000 10000 3800 10000 3600 10000 3400 8000 3200 6000 3000 6000 2800 5000 2700 5000 2600 4000 2200 4000 1800 3000 1650 2500 1350 2000 1350 2000 1100 1800 1100 1600 1000 1400 900 1300 800 1300 750 1100 700 1000 600 850 600 750 500 650 500 600 400 500 350 500 300 450
* DCR : DC Resistance
Electrical characteristics
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CHIP CERAMIC INDUCTORS
CI2012 |
Part No. CI-B2012-10Na CI-B2012-12Na CI-B2012-15Na CI-B2012-18Na CI-B2012-22Na CI-B2012-27Na CI-B2012-33Na CI-B2012-39Na CI-B2012-47Na CI-B2012-56Na CI-B2012-68Na CI-B2012-82Na CI-B2012-100a CI-B2012-120a CI-B2012-150a CI-B2012-180a CI-B2012-220a CI-B2012-270a CI-B2012-330a CI-B2012-390a CI-B2012-470a CI-B2012-560a CI-B2012-680a CI-B2012-820a CI-B2012-101a CI-B2012-121a CI-B2012-151a CI-B2012-181a CI-B2012-221a CI-B2012-271a CI-B2012-331a CI-B2012-391a CI-B2012-471a Inductance nH 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 Tolerance Q min. 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 15 15 15 15 15 15 15 15 15 15 15 15 10 10 10 10 10 L, Q test frequency(O 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50 ) SRF (O min. 4000 4000 4000 4000 3800 3600 3400 3200 3000 2800 2600 2200 1800 1650 1350 1350 1100 1100 900 900 850 750 700 600 500 450 400 350 330 300 270 220 180 ) typ. 12000 10000 10000 8000 8000 6000 6000 5400 4500 4000 3650 3000 2500 2450 2000 1750 1500 1500 1200 1300 1150 1050 1000 950 850 730 570 510 450 410 370 330 280 DCR (mO ) max. 100 100 100 100 100 100 130 150 200 230 250 280 300 350 400 450 500 550 600 650 700 750 800 900 1000 1300 1500 1800 2000 2500 3000 3500 4000
Rated current (mA) max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 250 250 250 250 250 250 250 250
3/4 0.3nH
3/4
5%
3/4 10%
* SRF : Self-Resonant Frequency.
* DCR : DC Resistance
Electrical characteristics
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CHIP CERAMIC INDUCTORS
RELIABILITY AND TEST CONDITIONS
CHIP CERAMIC INDUCTORS
ITEM
Operating temp. range Storage temp. & humidity range Resistance to solder heat
REQUIREMENTS 1005
-55E 40E
1608
~+125E
2012
TEST CONDITION
at packing condition Preheat temperature : 100 to 150E Preheat time : 1min Solder temperature : 260 3/4 10E Dipping time : 10 3/4 0.5sec. Preheat temperature : 100 to 150E Preheat time : 1min Solder temperature : 230 3/4 10E Dipping time : 3 3/4 1sec. Preheat temperature : 150E Preheat time : 1min Solder temperature : 230E Soldering time : 10 sec. Max. (Reflow soldering profile)
max. , 70% RH max.
1.No damage such as cracks should be caused in chip element. 2.More than 75% of the terminal electrode shall be covered with new solder. 3.Inductance change : 3/4 within 5% 4.Quality factor change : 3/4 within 30% 1.More than 90% of the terminal electrode shall be covered with new solder. 2.Inductance change : 3/4 within 5% 3.Quality factor change : 3/4 within 30%
Solderability
Reflow soldering
1.More than 50% of the terminal electrode shall be covered with new solder.
S S A T * 0.5 T
Tensile strengh (Terminalstrength)
1.No mechanical damage
W
Unit : Kgf(W)
(W k g f) m in
W Adhension of Terminal electrode (Flexure strength) a b c W Body strength (Bending strength)
1.No mechanical damage
1.0
2.0
c
-
1.0 0.8 1.3
Unit : mm (a,b,c), Kgf(W) 1.0
a
La n d
1.0 1.3
b a
1.0mm W
W 0R . 5
R 0.5
2.0 4.0 1.The body shall not be damaged by forces applied on the right.
d W
-
1.3 2.0
Unit : mm (d), Kgf(W) 1.3 3.0
T d
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CHIP CERAMIC INDUCTORS
CHIP CERAMIC INDUCTORS
ITEM
Drop Vibration
REQUIREMENTS 1005
1.No mechanical damae 1.No mechanical damae
1608
2012
TEST CONDITION
Drop 10 times on a concrete Floor from a height of 91cm Frequency : 10~55~10Hz Amplitude : 1.52mm Direction and time : X,Y,Z directions for 2 hours Step1. -40 3/43 E 30 3/43min. Step2. 85 3/43 E 30 3/43min. Number of cycle : 100 times
Thermal shock (Temperature cycle)
1.No mechanical damae 2.Inductance change : 3/4within 5% 3.Quality factor change : 3/4within 30%
Heat load resistance
1.No mechanical damae 2.Inductance change : 3/4within 5% 3.Quality factor change : 3/4within 30%
Low temp. resistance
1.No mechanical damae 2.Inductance change : 3/4within 5% 3.Quality factor change : 3/4 within 30%
Humidity resistance
1.No mechanical damae 2.Inductance change : 3/4 within 5% 3.Quality factor change : 3/4 within 30%
Humidity load resistance
1.No mechanical damae 2.Inductance change : 3/4 within 5% 3.Quality factor change : 3/4 within 30%
Temperature : 85 3/4 2E Applied current : rated current Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Temperature : -40 3/45 E Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Temperature : 40 3/4 2E Humidity : 90~95% RH Time : 500 hours Measured at room ambient temperature after placing for 24 hours Temperature : 40 3/4 2E Humidity : 90~95% RH Applied current : rated current Time : 500 hours Measured at room ambient temperature after placing for 24 hours
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CHIP CERAMIC INDUCTORS
a PACKING 1. Label 1) Part name. 2) Lot No. 3) Quantity. 4) Manufacturer. 2. Standard quantity for packing PCS Packing Type(EIA) 1005 1608 2012 Reel 10,000 4,000 3,000 Tape Inner & box reel Carton box 400,000 160,000 120,000 Bulk Vinyl or Cassette As wanted
100,000 40,000 30,000
* Packing method can be changed, based on users request.
a
TAPE DIMENSION/ Embossing
unit : mm SP ROCKE T HOL E 1 .5 + 0.1, - 0 O
8mm
1.753/4 0.1 CHIP CAVIT Y 3.53/4 0. 05
A B
8.03/4 0. 3
Type 1608 2012
A 3/4
0.1
B 3/4
0.1
P 3/4
0.1 4.0 4.0
K0 3/4
0.1
T (max.) 0.3 0.3
1.00 1.45
1.80 2.25
0.95 1.00
P
4.03/4 0. 1 2.03/4 0. 05
T Ko
a
TAPE DIMENSION/ Paper
unit : mm SPR OCKE T HOL E O 1.5 + 0. 1, - 0 CHIP CAVIT Y 1.753/4 0.1 3.53/4 0.05
Type
A B 8.03/4 0.3
A 3/4
0.1
B 3/4
0.1
P 3/4
0.1 2.0 2.0
T (max.) 0.8 1.1
1005 1608
0.65 1.00
1.15 1.80
P
4.03/4 0.1 2.03/4 0.05
T
a
LEADER AND BLANK PORTION
Bl ank 10 to 20 pitches Chips Bl ank 20 to 40 pitches Leader 210mm to 250 mm
Drawing directon i
The pitch holes shift within 3/4 0.3(R)
for cumulative 10 pitches
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CHIP CERAMIC INDUCTORS
a REEL DIMENSION
unit : mm O 13.03/4 0.5 2.03/4 0.8
Type
more than 50
W ((R) 9.0 3/4
) 0.3
1005, 1608, 2012
R1.0
O 21.03/4 0.8
O 1783/4 2.0 O 2543/4 2.0
les s t han 1.5
a
TOP COVER TAPE STRENGTH
165AE to 180AE T op cover tape
E mbossi ng tape
The force for tearing off top cover tape is 20 to 70 grams in the arrow direction
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CHIP CERAMIC INDUCTORS
a SOLDERING PROFILE 1. REFLOW SOLDERING
prehea ting 1 00 s ec m ax. 230 E 200 E so ldering 1 0 s ec m ax. cooling 60 s ec min.
150 E 60 s ec min.l
20 s ec max.
2. FLOW SOLDERING
prehea ting 100 s ec max. 250 E dipping 10 s ec max. cooling 60 s ec min.
150 E 60 s ec min.
3. MANUAL SOLDERING
300 E solder i ron 30w max.
soldering 2 s ec m ax. Tc E A T A 200 E / . 5 s ec Diameter of so lder i ron 1.2mm max.
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